mask (Total 58026 Patents Found)

Mask (58026 Patents Found)
A filtering face mask that covers at least the nose and mouth of a wearer and that includes an exhalation valve. The exhalation valve opens in response to increased pressure when the wearer exhales to allow the exhaled air to be rapidly purged from the mask interior. An exhale filter element is placed in one of several...
A structure for independently supporting a wafer and a mask in a processing chamber is provided. The structure includes a set of extensions for supporting the wafer and a set of extensions supporting the mask. The set of extensions for the wafer and the set of extensions for the mask enable independent movement of the ...
One illustrative method disclosed herein includes forming at least one layer of insulating material above a conductive structure, forming a patterned hard mask comprised of metal above the layer of insulating material, performing at least one etching process to define a cavity in the layer of insulating material that e...
The present invention relates to a welding mask for protecting the eyes of a user from a strong welding light during welding. More particularly, the present invention relates to a welding mask which has a face protecting plate made of a transparent material to protect the face of a wearer from the heat and flame of wel...
The present invention relates to a reflective mask blank containing in this order, a substrate, a multilayer reflective film that reflects exposure light, and an absorber layer that absorbs the exposure light, in which the reflective mask blank further contains a fiducial mark indicating a reference position of the mul...
A device, system and method for assigning values to elements in a first register, where each data field in a first register corresponds to a data element to be written into a second register, and where for each data field in the first register, a first value may indicate that the corresponding data element has not been...
A phase shift mask is provided which includes: a substrate that is transparent to irradiation light, a shielding region formed on the substrate and in which a line pattern is formed, and a first transparent region and a second transparent region located on respective opposite sides of the shielding region on the substr...
A method for forming a photo-mask is provided. A first photo-mask pattern relating to a first line, an original second photo-mask pattern relating to a first via plug, and a third photo-mask pattern relating to a second line are provided. A first optical proximity correction (OPC) process is performed. A second OPC pro...
A mask for photolithography and methods of manufacturing a mask and a semiconductor device are provided. The method of manufacturing a mask may comprise providing a substrate, forming a phase shift material layer on the substrate, forming a light blocking layer on the phase shift material layer, and forming a main patt...
In an example, a process for bonding a dry film solder mask (DFSM) material to a printed circuit board (PCB) laminate material is disclosed. The process includes applying a DFSM material that includes a dienophile functional group to a PCB laminate material that includes a diene functional group. The process further in...
A method for making a laminated chip includes: (a) forming a first conductive layer on a substrate; (b) forming an insulating layer on the first conductive layer opposite to the substrate; (c) bombarding the insulating layer using an electron beam to form a plurality of holes that expose the first conductive layer; and...
A manufacturing method of a power MOSFET employs a hard mask film over a portion of the wafer surface as a polishing stopper, between two successive polishing steps. After embedded epitaxial growth is performed in a state where a hard mask film for forming trenches is present in at least a scribe region of a wafer, pri...
A mask blank substrate is provided with a substrate mark comprising an oblique section. The inclination angle of the substrate mark with respect to a main surface is greater than 45° and less than 90° and the distance from the boundary between the main surface and the substrate mark to the outer periphery of the mask...
A method for fabricating an integrated circuit includes the steps of: providing a substrate having a semiconductor surface; providing a hardmask material on the semiconductor surface. For at least one masking level of the integrated circuit: providing a mask pattern for the masking level partitioned into a first mask a...
L'invention concerne un procédé pour reproduire un masque (1) sur un substrat (2) au moyen d'une unité d'éclairage (8) et d'une unité optique (9). L'invention concerne en outre un dispositif pour la mise en oeuvre dudit procédé. L'objectif de l'invention est de concevoir un procédé ...
La présente invention concerne un masque (1) et un procédé de fabrication d'un élément d'espacement (2) à l'aide dudit masque (1). Le masque (1) comprend une région transparente et une région non transparente. La région transparente comprend de multiples trous traversants (230) optiques agencés en...
【課題】濃硫酸を用いた洗浄処理においてエッチングストッパ層のサイドエッチングを抑制することができるハーフトーンマスクを提供する。 【解決手段】上記ハーフトーンマスクは、透過部TAと、半透過部HAと、遮光部PAとを具...
Disclosed is a method of producing a block mask, which is employed in an electron-beam lithography apparatus, with high precision irrespective of the size of openings. The electron-beam lithography apparatus is of a type that produces a unit pattern at a time by transmitting an electron beam through openings selected f...
Microphonic suppressors are included in a color cathode ray tube. The suppressors are attached to the shadow mask and extend within the space between the mask and tube wall. One end of the suppressor contacts the tube wall. Constructed of spring-like material, the suppressors absorb sound waves generated within the tel...